Electronic Design Interchange Format

Released in 1993, EDIF Version 3 0 0 enhanced the EDIF standard by improving the representation of connectivity information and adding the ability to accommodate Schematic Frames. EDIF Version 3 0 0 effectively eliminated the problems earlier versions had translating multi-bit connectivity between EDA environments. The standard handles busses, bus rippers, and busses across multi-page schematics. Additionally, EDIF Version 3 0 0 incorporates a formal information model that will result in higher quality EDIF transfers. This version has been formally endorsed by Electronic Design Automation Companies (EDAC). In November 1983, representatives of seven organizations met to discuss the feasibility of a standard interchange format. Daisy Systems, Mentor Graphics, Motorola, National Semiconductor, Tektronix, Texas Instruments and the University of California at Berkeley formed what became known as the EDIF Steering Committee. Convinced that a standard format was both attainable and essential, the Steering Committee commissioned a Technical Committee to review the current formats, identify their strengths and combine these strengths into one all-encompassing format. Recognizing the need to address other types of design automation technology that the Technical Committee had neither the time nor expertise to address by itself, several technical subcommittees were created: the Schematic Technical Subcommittee, to deal with schematic transfer issues ; the Test Technical Subcommittee, to deal with test data transfer formats; the PCB Technical Subcommittee, to deal with printed board standard development; and the LPM Technical Subcommittee, to handle Library of Parameterized Modules issues. In addition there was a Logic Modeling Subcommittee that attempted to characterize simple logic models with timing, and a Procedural Subcommittee, concerned with parametric and algorithmic levels of EDIF description, and with keyword abbreviations and macros. At the same time,The USA EDIF Interest Group was formed to review proposals, air problems and make suggestions. It organises an annual conference, normally in the Fall. The efforts of the EDIF Steering and Technical Committees quickly earned the respect of the industry. In September 1986, the Solid State Products Division of EIA agreed to adopt EDIF. This assimilation into EIA, with the association's organizational structure, standardization procedures, balloting experience and Washington presence, strengthened the EDIF effort significantly. In September 1992, the various EDIF committees were reorganized into a new division of EIA, the Electronic Information Group . The EDIF Division, along with four other divisions began official operations in January 1993.