🌐EnglishEnglishDeutschItaliano한국어中文日本語EntityQ677010· pop 7· linked from 27 articleswafer bondingpackaging technology on wafer-level for the fabrication of microelectromechanical systems etc., ensuring a mechanically stable and hermetically sealed encapsulationAvailable in 7 languagesDeutsch中文日本語ItalianoCatalan한국어via Wikidata sitelinks · CC0ConnectionsInternational Standard Book NumberEntitydigital object identifierEntityCategoriesChemical bondingElectronics manufacturingPackaging (microfabrication)Semiconductor technologyWafer bonding