Skip to content
electromigration
EntityQ1319010· pop 16· linked from 73 articles

electromigration

Sign in to save

thumb|Electromigration (red arrow) is due to the momentum transfer from the electrons moving in a wire Electromigration is the transport of material caused by the gradual movement of the ions in a conductor due to the momentum transfer between conducting electrons and diffusing metal atoms. The effect is important in applications where high direct current densities are used, such as in microelectronics and related structures. As the structure size in electronics such as integrated circuits (ICs) decreases, the practical significance of this effect increases.

~25 min read

Encyclopedic overview

27 sections
Contents
  • History
  • Practical implications of electromigration
  • Fundamentals
  • Forces on ions in an electrical field
  • Step bunching due to electromigration
  • Failure mechanisms
  • Diffusion mechanisms
  • Thermal effects
  • Balance of atom concentration
  • Electromigration-aware design
  • Electromigration reliability of a wire (Black's equation)
  • Wire material
  • Bamboo structure and metal slotting
  • Blech length
  • Via arrangements and corner bends
  • Electromigration in solder joints
  • Electromigration and technology computer aided design
  • Constraint programming
  • Prediction tools
  • Healing
  • Electromigrated nanogaps
  • Reference standards
  • See also
  • References
  • Further reading
  • Books
  • External links

thumb|Electromigration (red arrow) is due to the momentum transfer from the electrons moving in a wire Electromigration is the transport of material caused by the gradual movement of the ions in a conductor due to the momentum transfer between conducting electrons and diffusing metal atoms. The effect is important in applications where high direct current densities are used, such as in microelectronics and related structures. As the structure size in electronics such as integrated circuits (ICs) decreases, the practical significance of this effect increases.

== History == The phenomenon of electromigration has been known for over 100 years, having been discovered by the French scientist Gerardin. The topic first became of practical interest during the late 1960s when packaged ICs first appeared. The earliest commercially available ICs failed in a mere three weeks of use from runaway electromigration, which led to a major industry effort to correct this problem. The first observation of electromigration in thin films was made by I. Blech. Research in this field was pioneered by a number of investigators throughout the fledgling semiconductor industry. One of the most important engineering studies was performed by Jim Black of Motorola, after whom Black's equation is named. At the time, the metal interconnects in ICs were still about 10 micrometres wide. Currently interconnects are only hundreds to tens of nanometers in width, making research in electromigration increasingly important.

Excerpted from Wikipedia’s “electromigration” article, available under the CC BY-SA 4.0 licence.

Gallery (6)