thumb|250px|A commercial AJA Orion sputtering system at Cornell NanoScale Science and Technology Facility thumb|Ion thruster operating on iodine (yellow) using a xenon (blue) hollow cathode. High-energy ions emitted from Spacecraft electric propulsion|plasma thrusters sputter material off the surrounding test chamber, causing problems for ground testing of high-power thrusters. In physics, sputtering is a phenomenon in which microscopic particles of a solid material are ejected from its surface, after the material is itself bombarded by energetic particles of a plasma or gas. It occurs natural
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溅射（sputtering），也称溅镀（sputter deposition/coating），是一种物理气相沉积技术，指固體靶"target"（或源"source"）中的原子被高能量離子（通常來自等離子體）撞擊而離開固體進入氣體的物理过程。 溅射一般是在充有惰性气体的真空系统中，通过高压电场的作用，使得氩气电离，产生氩离子流，轰击靶阴极，被溅出的靶材料原子或分子沉淀积累在半导体晶片或玻璃、陶瓷上而形成薄膜。 溅射的优点是能在较低的温度下制备高熔点材料的薄膜，在制备合金和化合物薄膜的过程中保持原组成不变，所以在半导体器件和集成电路制造中已获得广泛的应用。 包括： * 直流溅射 * * * * 磁控溅射 * *
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